Shear Stud Connectors. These point loads may be caused by other beams, user input loads, or columns carried by the beam. The XCede HD2 connector family consists of modular configurations with custom power and guidance. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede. And each fiber cable transmits at 10Gbps. XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. Reboot the switch to enable the change. Offering a linear density of up to 84 differential pairs per inch and can. PCIe Gen. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Send us a Message. 40G QSFP+ to QSFP+ DAC Cable. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high XCede HD2 backplane interconnect system. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. Features & Benefits. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Login or REGISTER Hello, {0}. 4. 3、4和6对设计. 2" long and has an x4 connector. 2. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Skip to Main Content. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 2-, 3-, 4-, 5-, 6-Pair configurations. Complementary guide and power modules are also included in the product range. 8 mm, Receptacle, Press Fit. XCede Connectors are available at Mouser Electronics. The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. EN. {{metaDescription}} FCI’s XCede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. 2. ExaMAX® 2. DETAILS. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. 2. TARGET MARKETS. Four-pair connectors provide 54. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. A Loyalty Bonus Cash of $1,500 (applied after taxes) is offered on all new 2022 Ram 1500 Classic models and applies to current and original owners of a Chrysler, Dodge, Jeep,. High-density backplane system – up to 84 differential pairs per linear inch. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. 9 signal pairs per inch are. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Login or REGISTER Hello, {0}. 1. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. 4. English. Lukin 08/19/13 “B” S2483 Update Max force per pin spec E. XCede HD achieves the highest performance in an HM compatible form factor. TARGET MARKETS. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. 0 REFERENCE 2. The XCede HD connector. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices ExplainedDislaime Please note that the above information is subject to change without notice. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. 1. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Nov 13, 2019. 2. XCede. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Part # dimensions for each XCede connector type. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. Login or REGISTER Hello, {0}. Description Value; ECCN: EAR99. Contact Mouser (USA) (800) 346-6873 | Feedback. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. DC Connector Configurations XCede HD connector system. 0 TOOLING 1. Backwards mate compatibility. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 DOCUMENTS 2. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Up to 82 differential pairs per linear inch. XCede ® HD is a small form factor system with a modular design for significant space savings and. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall XCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. XCede® HD 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. Welcome to Wille Dodge, a family-owned dealership with 44 years of. power connector (J_PWR_B) 7. 4、6或8列. KK connector systems are customizable for a variety of power and signal applications. Skip to Main Content (800) 346-6873. 2. com. 1. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. Login or REGISTER Hello, {0}. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. 8 mm, Header, Press Fit. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. 1. Complementary guide and power modules are also included in the product range. No spam. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. Close Modal. Board-to-board connector / rectangular / SMT. see tb-xxxx for board weight limitations. DC connector configurations are determined by the customers’ system application. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 00mm: 2 - 54: 1. Contact Mouser (USA) (800) 346-6873 | Feedback. Wille Dodge Chrysler Jeep Ram, Victoria, British Columbia. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Login or REGISTER Hello, {0}. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. 信号端子上可实现高达3. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. Login or REGISTER Hello, {0}. Buy Amphenol JX41051436 in Avnet APAC. Up to 3. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. Backwards mate compatibility. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. Features. The company manufactures MIL-DTL-5015, both Front and Rear Release versions, MIL-DTL-83723 Series III, MIL-DTL-28748 rack and panel, Reverse Bayonet, and. 1. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. 8 mm, Header, Press Fit. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. 1. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. - FCI. 08mm. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. XCedeHD RAM and XCede HD Inverted RAMrefer to. 2. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series High Speed / Modular Connectors. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. Mouser offers inventory, pricing, & datasheets for XCede Connectors. Subscribe news. Description Initial Date “-“ S1188 Initial Release T. XCede® connectors also. Available with 40, 60 and 80 signal pins. 1. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Amphenol Communications Solutions XCede high-performance backplane connector system. Customer Measurement Report: FCI XCede® Connector. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. 1. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). Environmental Compliance. Features. Three levels of sequencing enable hot plugging. XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Rugged Edge Rate® contact system. Login or REGISTER Hello, {0}. Xcede® HD High Speed Backplane Connectors. 9 signal pairs/inch and can be used down to 25 mm card slot pitch. 1. 2. 1. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. Login or REGISTER Hello, {0}. XCede HD achieves the highest performance in an HM compatible form factor. Amphenol XCede High Speed / Modular Connectors are available at Mouser Electronics. Integrated power, guidance, keying and side walls available. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. Improves signal integrity and increases signal. Choice of 2 or 4 power banks. 0 REFERENCE 2. 54, 3. Description. XCede® connectors also address. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. 1. 2. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. The XCede ® I/O connector supports next generation 100G+ applications and. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Login or REGISTER Hello, {0}. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. This connector ships without wires, terminals and seals. 0” Long. FEATURES. 54mm pitch down to 0. XCede® connectors also address. Scalable upgrades to 56Gb/s. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Modular design provides flexibility in applications. Login or REGISTER Hello, {0}. - FCI. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. . Dislaime Please note that the above information is subect to change without notice. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. 特色. by Xcede. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. 7mil Drill Minimum Pad Size vs. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCede® HD是一个采用. 27 - 12. 3、4和6对设计. Other items. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . 2-, 3-, 4-, 5-, 6-Pair configurations. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 80mm Right-Angle Backplane Receptacle; HDTF - Samtec XCede® HD 1. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. 3-, 4- and 6-pair designs. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. XCede® RAM. XCedeHD RAM and XCede HD Inverted RAMrefer to. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. 1. Amphenol Communications Solutions. Female pin. Scalable upgrades to 56Gb/s without costly redesigns. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. High-density backplane system – up to 84 differential pairs per linear inch. XCede® connectors also address. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). c-jx410-51594 a creo files jx410-51594_bp . XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 423-0155-500 MOUNTING BLOCK. Please confirm your currency selection:2. 1. These connectors are available in 3-, 4- and 6-Pair configurations. PDF 957-4100-AXX 4 PAIR POWER. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. 7. Out of these, the cookies that are categorized as necessary are stored on your browserGermany. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Find Parts. Two press-fit sizes, (standard and small) provide board layout options for designers. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. . Español $ USD United States. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. XCede Plus Backplane Connector. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. 6. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. XCede® connector family. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 信号端子上可实现高达3. 5 - Effective capacity assumes average 4:1 data reduction. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. 6. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 三个等级的上电次序实现了热插拔. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Samtec XCede® HD HPTS 3. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. Find Parts Learn More. . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Inactivity Warning Dialog. Brand of Product：Amphenol ICC,Part#：946-210X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 20mm Power Modules. XCede Daughter Card PWB + Fixture Thickness Requirements and Compliant Pin Protrusion Lengths XCede Connector Type/Size PWB + Fixture Thickness Minimum (mm) 0. These modules consist of a 12. 1. Search. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. 4、6或8列. €65000 - €95000 per annum + Bonuses. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. 5-inch backplane 1. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices Explained%PDF-1. 99. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede Connectors are available at Mouser Electronics. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. Login or REGISTER Hello, {0}. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 00 mm的触点滑动范围. 12 - 48 pairs. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. We offer interconnection systems from 2. Features. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). 1 FMC VITA 57. XCede® connectors also address. 2. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. Please confirm your currency selection:Buy XCede HD Series Backplane Connectors. Login or REGISTER Hello, {0}. 4. HDTM. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Español $ USD United States. XCede® HD 1. Contact us today for more details of XCede HD, part number 968-4200-A1H. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Login or REGISTER Hello, {0}. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. Login or REGISTER Hello, {0}. Revision “D” Specification Revision Status . 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingBuy XCede HD2 Series Backplane Connectors. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Back. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. Skip to Main Content (800) 346-6873. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. 1. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® connector family. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. See Appendix "A" for the seating press recommendations and process recommendations. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82.